Abstract

The fabrication and characteristics of Npn AlGaAs/GaAs single heterojunction bipolar transistors (HBTs) with an emitter edge-thinning structure have been studied. A new and simple selective wet etching method was used to make the emitter edge-thinning structure. The best device obtained shows a common emitter differential current gain of 8700. To our knowledge, this is the highest current gain of AlGaAs/GaAs HBT grown by MBE reported to date. The Gummel plot of this device is analyzed and compared with another HBT which has no emitter edge-thinning structure and was fabricated on the same epiwafer. It is found that the base current of the emitter edge-thinning device is one-tenth smaller than that of the controlled device. In low current region, the effect of emitter edge-thinning structure is even more significant. Because of the reduction of 2-kT surface recombination current, the emitter edge-thinning device reveals its intrinsic 1-kT base current in high current region.

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