Abstract
Using miniature columns in a multicolumn architecture in a high-speed wafer inspection system capable of detecting small defects at speeds compatible with high volume manufacturing is feasible if the columns can deliver enough current to the sample and if they can be scaled sufficiently to meet the throughput requirement. The authors show that miniature columns currently in production can meet the required beam current and spot size specifications by modifying an aperture. Simulations of the column show that, because of the length of the column, Coulomb interactions do not significantly limit the current that can be delivered to the sample. The authors discuss scaling and present reasons why the technologies used to manufacture the production columns are capable of producing columns with dimensions small enough to be arrayed in a multicolumn configuration for high volume manufacturing inspection.
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