Abstract
Nanocrystalline copper-nickel T-structures and micro-gears were electrodeposited using the UV-LIGA process with the possibility of composition and thickness control. A 3D model, applicable to various architectures, was proposed based on experimental results, using the COMSOL software. The performed experiments and simulations were very accurate in terms T-structures composition, thickness and growth rate. A micro-gear was deposited to demonstrate the efficiency and possibilities of the investigated approach. This study allows the development of new architectures for applications, such as MEMS, NEMS, magnetic, actuators, non-magnetic gaps in recording write heads, conductor wires, thermoelectric devices, sensors, etc.
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