Abstract
HighlightsHierarchically multifunctional polyimide composite films were fabricated by hierarchical design and assembly strategy.Polyimide composite films have three functional layers and integrates high thermal conductivity (95.40 W (m K)−1), excellent EMI shielding (34.0 dB) and good tensile strength (93.6 MPa).Polyimide composite films present broad application prospects in electronics fields according to the test results in the central processing unit.
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