Abstract
We investigate the heat transfer property of thin-film encapsulation (TFE) for organic light-emitting diodes (OLEDs). It is demonstrated that the TFE combined with a flexible heat sink shows better thermal performance, compared with the epoxy-filled glass encapsulation and the conventional glass encapsulation. By way of experiments and simulations, we verify that the multi-heterojunction configuration and the low thermal conductivity of the polymer layer in the TFE film have no impact on the thermal performance. Furthermore, we find through simulations that a significant temperature gradient appears inside the TFE layers only when the thermal conductivity of the polymer is lower than 1 × 10 −3 W/m K. This enables us to perform design optimization of the TFE configuration with relaxed heat dissipation.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.