Heat Transfer Performance Analysis of Screen Mesh Wick Heat Pipe Using CuO Nano Fluid

Shylesha V Channapattana,Srinidhi Campli,Saurabh B Raut,Sandeep S Sarnobat,Tapobrata Dey,Abhay A Pawar

doi:10.20897/ejosdr/3927

Shylesha V Channapattana, Srinidhi Campli + Show 4 more

Open Access

https://doi.org/10.20897/ejosdr/3927

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Abstract

In this paper, the effect of multilayer screen mesh wicks and CuO nano-fluid as working fluid is investigated on the performance of heat pipe. Three heat pipes were fabricated with different layers of screen mesh wicks to improve capillary action of working fluid. Heat pipes of 350 mm length and 19.5 mm diameter were used. The different mesh configurations used in this work were 100+150 mesh, 100+2X150 mesh and 4X150 meshes. The concentration of CuO nano-fluids in the experiments was maintained at 1% by weight of water. The heat pipes are tested with water and CuO as working fluid for different heat inputs of 35W, 50W 75W, 100W and 120W. The thermal resistance and heat transfer rate were determined. It is found that the thermal resistance decreases with increase in heat input. There is increase in heat transfer rate in case of CuO nanofluid loading in ordinary water compared to distilled water as working fluid. For all orientation the maximum heat transfer through the heat pipe increased as the number of mesh layer of the wick is increased. The heat transfer rate is found to be maximum at 100 l/h mass flow rate compared to that of 150 l/h.

Highlights

The heat pipe has been widely used for cooling high power density devices due to its high effective conductivity, good heat spreading capability and geometric flexibility
An experimental investigation is carried out to determine the effect of 1.0% concentration of CuO nanoparticle mixed in water as base fluid on heat transfer characteristics of multilayer screen mesh wick heat pipe
The overall heat transfer coefficient is found to increase for CuO nanoparticle than that of water

Summary

INTRODUCTION

The heat pipe has been widely used for cooling high power density devices due to its high effective conductivity, good heat spreading capability and geometric flexibility. Kempers et al carried out an experimental study to determine the effect of the number of mesh layers and amount of working fluid on the heat transfer performance of copper-water heat pipes with screen mesh wicks. They found that the effective thermal resistance decreases with an increase in heat flux, and approaches an approximately constant value at higher heat fluxes. Hassan et al carried out experimental and numerical study on cooling of an electronic component using flat heat pipe having water based Cu, CuO and Al2O3 nanoparticles as working fluid They have considered the effects of diameter of nanoparticles, volume fraction, wick porosities and wick thicknesses on performance of heat pipe.

EXPERIMENTAL PROCEDURE

AND DISCUSSION

Findings

CONCLUSIONS