Abstract
Abstract This study explores the thermal performance of copper heat pipes filled with surface-modified silver nanoparticle-stabilized nanofluids. The aim was to assess the effect of different nanoparticle surface chemistries on key heat transfer parameters such as thermal resistance and heat transfer coefficient (HTC). Five silver nanofluids stabilized by Polyethylene Glycol (PEG), Branched Polyethyleneimine (bPEI), Polyvinylpyrrolidone (PVP), Citrate, and Lipoic Acid were evaluated under heat inputs ranging from 50 W to 90 W and filling ratios of 60% and 70%. K-type thermocouples were used to measure temperature, from which thermal resistance and HTC were calculated. The bPEI-stabilized nanofluid demonstrated the best performance, reducing thermal resistance from 0.0540 °C/W at 50 W to 0.0420 °C/W at 90 W, while increasing HTC from 1680 W/m2 °C to 2320 W/m2 °C. Response Surface Methodology (RSM) confirmed that higher filling ratios and heat inputs significantly enhanced heat transfer. These findings highlight the potential of surface-modified silver nanofluids to improve thermal management systems, particularly in high heat flux applications. Further research is suggested to explore long-term stability and the scalability of these nanofluids for industrial use.
Published Version
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