Abstract
The scope of the article includes the description of the experimental setup, methodology of the experimental studies, the study results for pool boiling heat transfer coefficient encountered on sintered capillary porous coverings. The results of own studies presented here refer to the boiling in a large volume on copper fibrous coverings. Hysteresis type I, II and III were described. Several examples of capillary porous surface coverings applications in purposely chosen complex boiling heat transfer processes have been presented based on Wojcik and Poniewski patents.
Highlights
Transferring large heat fluxes is one of the most significant issues of today’s technology and results from the rapid development of electronics, nuclear, space, military and medical technologies, and various others
The results of the experiments confirmed a significant effect of porous structure parameters on the heat transfer intensity
Porous coatings have a disadvantage consisting in their tendency to instability, which shows as a non-explicit course of boiling curves at the increase and decrease in the heat flux
Summary
Transferring large heat fluxes is one of the most significant issues of today’s technology and results from the rapid development of electronics, nuclear, space, military and medical technologies, and various others. The growing computing power of processors increases the amount of heat and forces extensive cooling. Heat transfer on a flat surface, even at boiling, has become insufficient. There is an urgent need for new solutions. In years 1995-2009 the author and co-workers conducted comprehensive research related to heat transfer for pool boiling on extended surfaces. The studies included experimental and theoretical investigations, developing technologies and the issues of lab-scale manufacturing of sintered porous structures (both metal, fibrous and new complex ones worked out by the author and co-workers), as well as application-related problems such as the use of a boiling process in heat transfer control
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