Abstract
High-performance compact heat sinks have been developed for effective cooling of high-density LSI packaging. Heat transfer and pressure loss characteristics of the heat sinks in both air-cross flow and air-jet cooling have been experimentally studied. The present heat sinks were of plate-fin and pin-fin arrays with a fin pitch of 0.7 mm. The plate-fin heat sinks had higher cooling performance than the pin fin heat sinks in the range of large air flow rate both in air-cross flow and air-jet cooling. The thermal conductance in cross-flow cooling was 20 or 40% larger than that in jet cooling. The correlation of Colburn j-factor/Fanning friction factor vs. the Reynolds number for the present heat sinks was found to be very close to that of a conventional large size heat exchanger.
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