Abstract
Applying software Ansys-Fluent to analysis the effect of piezoelectric fan device installed inside rectangular channel by numerical simulation method. The piezoelectric fan is activated by reversible piezoelectric effect in piezoelectric material, change rectangular channel flow field construction, then it affects heat flow status in advance. Numerical simulation parameter are included Nusselt number (Nu), distance between peak of fan blades to front part of heat sink (Lg=0, 5, 10, -11.25, -22.5, -33.75, -45), height from center on piezoelectric fan bottom side (Hw=10, 16, 21), number of piezoelectric fan (single-fan and twin-fan), phase-shift (in-phase and counter-phase), and numbers (n=10, 14) for heat sink fin. This result is indicated that good position to temperature dropped greatly is located from the front part of piezoelectric fan to the front of heat sink (Lg = -22.5) under fixes distance (Hw = 21) from piezoelectric fan to channel also found to provide double piezoelectric fan heat drop effect is equal to single one, however, double piezoelectric fans would provide higher heat dissipation as Counter-phase. The performance of piezoelectric fan is improved depends on change height (Hw) from center of piezoelectric fan to channel bottom; the height (Hw) shall be decreased as piezoelectric fan placement at the front of heat sink.
Highlights
With advances in semiconductor process technology and development, electronic components toward slim and light design concept, the challenge facing the problem of overheating the more gradual increase
El-Sayed et al [2] varied the fin-height, fin-width, space between fins, fins-number and the distance of fin tips from the shroud to investigate the performance of plate-fin heat sink; their conclusions were that the pressure drop increases with increasing Reynolds number and fin height but decreases with increasing inter-fin space and fin width, that increasing the clearance between the fin tips and the shroud decreases the mean Nusselt number, and that the mean Nusselt number increases with increasing Reynolds number, fin width and space between fins but with decreasing fin height
The results showed that the fan under higher frequency resonance mode electromechanical coupling coefficient have better performance, but used in electronic cooling system for an extra considerations commercial specifications
Summary
With advances in semiconductor process technology and development, electronic components toward slim and light design concept, the challenge facing the problem of overheating the more gradual increase. Buermann et al [6] apply topology to analyze flow field from piezoelectric fan, as above mention, piezoelectric fan is equipment with advantage of low-power, tiny, and low noise...etc, that easy to apply on portable electric product They analyze effect resulted from piezoelectric material by Bernoulli equation and Finite element, this analysis provide perfect length ratio of piezoelectric fan and thickness on blade top for max. Acikalin et al [9] to flow visualization experiments way to assess the feasibility of the pressure applied to the electronic fan cooling system, using three sets of piezoelectric fan placed vertically and placed in a piezoelectric fan level to explore its transfer heat transfer coefficient, piezoelectric fan explore the feasibility of electronic components used in thermal performance. This study intended to develop a design with low thermal resistance, and to provide a new design direction for the present plate-fin heat sink cooling module design
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