Heat Dissipation Structure and Test System Design of a New Piezoelectric Fan

Abstract

The heat dissipation structure of a new piezoelectric fan is put forward in this paper; the system adopts the piezoelectric fan embedded design, which realizes efficient and stable heat dissipation for the target without increasing the volume of the device. The system adopts the improved piezoelectric fan structure, on the basis of orientation, low power consumption, low cost, and highly efficient heat dissipation, realizes key technologies such as low noise, temperature control, and leakage prevention. This paper introduced composition and characteristics of the new heat dissipation structure in detail and conducted thermal stress simulation, built test platform, carried out temperature test for the physical object, and realized the integrated iterative closed-loop design of thermal design, thermal simulation, and thermal test.