Abstract
Tungsten is a promising plasma-facing material because of its low sputtering yield, high melting point and high thermal conductivity. The hardness loss and microstructure evolution of pure tungsten hot-rolled to 90% thickness reduction is investigated by isothermal annealing at temperature range of 1200–1350°C. Changes in the mechanical properties caused by recovery and recrystallization during heat treatment are detected by Vickers hardness measurements. Additionally, the microstructural evolution is analyzed with light optical microscopy and X-ray diffraction. The results indicate that the hardness evolution can be divided into two stages: recovery and recrystallization. Recrystallization of W90 in the temperature range of 1200 to1350 °C is governed by the same activation energy as grain boundary diffusion. The average recrystallized grain size is larger for lower annealing temperatures.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.