Hard nanocomposite Ti–Si–N coatings prepared by DC reactive magnetron sputtering

Abstract

Films resulting from Si additions to TiN matrix were prepared with Si contents in the range 0–19 at.%, using a closed field unbalanced DC magnetron sputtering system. Transmission Electron Microscopy (TEM) analyses revealed the nanocrystalline nature of these coatings, confirming the results of grain size evaluation from X-ray diffraction (XRD) patterns. Nanoindentation tests and scratch tests were carried out for the mechanical characterisation. Regarding the results, the samples show hardness values as high as 45 GPa. Best hardness values were found for Si content in the range 4–10 at.%. Almost all samples showed high critical loads for total adhesion failure, generally higher than 80 N, although the critical load for the first adhesion failure was found to be lower than 20 N for several samples. XRD patterns revealed the presence of only one phase that can be assigned to a cubic B1 NaCl structure, typical for TiN, with a lattice parameter of approximately 0.430 nm. The preferential growth, as a function of Si content, changes from a strong (111) orientation at the lowest Si additions to a weak (200) orientation at the highest Si content. Density values in the range 3.0–3.7 g/cm 3 were obtained for most of the samples prepared with deposition rates between 0.5 and 1.1 μm/h, although higher density values were obtained for higher Ti deposition rates, with maximum of approximately 4.7 g/cm 3 for the case of samples with low Si content.