H132 基板上に実装された電子部品の発熱量測定手法の開発(OS-8: 電子機器・デバイスの熱課題)

Abstract

Three dimensional numerical analysis is utilized for thermal design of electronic devices. In this calculation, heat productions of electronic component are needed for input values, and they have an important consequence for prediction accuracy. But, it is often the case that the values are imprecision, because it is not well defined to measure or calculate the values at the moment. We developed a measurement method that is used a water cooled heatsink and thermocouples. Heat productions are estimated by direct measurement of the water temperature and flux, and it is executed in the state that electronic circuit is operated.