Abstract
For packages with high-density interconnections, crosstalk noise can cause signal errors. For cases with strong coupling between lines, design guidelines for packaging complementary metal-oxide-semiconductor (CMOS)-based circuits are developed here that incorporate crosstalk requirements with the tradeoffs related to the ringing problem on the active line, and the risetime requirements at the receiver. Semiempirical relations are given that can be used easily to obtain electrical parameters with given crosstalk, overshoot, and risetime at the receiver. Simulation program with integrated circuit emphasis (SPICE) simulation has been used to verify the accuracy of these expressions for some special cases. It is shown that the semiempirical relations work well for cases with strong coupling. Based on the design relations, it is shown that when the cross-sectional dimensions of a package system are reduced in order to increase packing density, the relative driver and receiver area have to be increased in order to maintain prespecified performance requirements.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
More From: IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.