Abstract
AbstractPolycrystalline silicon (poly-Si) films are of great interest in the field of TFT fabrication for active matrix liquid crystal display(AM-LCD) applications. Low temperature depositions below 500 °C are necessary for using a glass substrate for the application to large area devices such as display devices. We investigated poly-Si growth at low temperature by plasma enhanced chemical vapor deposition (PECVD). Cathode deposition is used in which substrates are mounted on the powered electrode and a mesh electrode is attached on the cathode for protecting the growing surface from ion impacts. It is found that poly-Si films can be deposited in the wide range of SiH4 concentration even at 100%, and a high deposition rate of 35nm/min has been realized. This investigation gives highly promising results for poly-Si growth technology at low temperature.
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