Abstract

InP high electron mobility transistor (HEMT) structures with In 0.53Ga 0.47As channels and In 0.52Al 0.48As barriers were grown by molecular beam epitaxy. A GaTe source was used as an n-type dopant. Conventional structures with 50–100 Å InAlAs(Te) layers and Te-delta-doped structures were investigated. Both types of structures exhibited good transport characteristics, with mobilities of 8000–10,000 cm 2/V-s and sheet densities of 1–4×10 12/cm 2. Fluorination studies showed similar behavior for Si- and Te-doped HEMT structures, with donor deactivation resulting in substantial reductions in mobility and carrier density after exposure to fluorine.

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