Abstract
Continuous and ultrathin platinum (Pt) films were deposited on tungsten (W) adhesion layers using atomic layer deposition (ALD) techniques. Pt ALD films were deposited at 120 °C using MeCpPtMe3 and H2 plasma as the reactants. X-ray reflectivity studies observed the rapid nucleation of the Pt film. X-ray photoelectron results were consistent with layer-by-layer growth suggesting a continuous Pt film at thicknesses ≥1.5 nm. The high surface energy of the W ALD adhesion layer enables the growth of continuous and ultrathin films of lower surface energy metals and should facilitate the use of precious metals for a variety of applications.
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