Abstract
In this letter, we report on the kinetics of growth of aluminum gallium nitride films by rf plasma-assisted molecular-beam epitaxy on (0001) sapphire substrates at the temperature range of 750–800 °C. The determination of the incorporation probabilities of aluminum and gallium atoms was arrived at by measurements of the growth rate and composition of the films. We find that, in both the nitrogen-rich and group-III-rich growth regimes, the incorporation probability of aluminum is unity for the entire investigated temperature range. On the other hand, the incorporation probability of gallium is constant and equals 0.75 at a substrate temperature of 750 °C only in the nitrogen-rich growth regime. The temperature dependence of the incorporation probability in this regime has an activation energy of 2.88 eV which is consistent with gallium desorption from the surface. In the group-III-rich growth regime, the incorporation probability of gallium decreases monotonically with group-III fluxes due to the competition with aluminum for the available active nitrogen. In this regime, the GaN phase growth rate is determined by the capture probability of the available active nitrogen from the gallium surface adlayer.
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