Growth kinetic studies of Cu–Sn intermetallic compound and its effect on shear strength of LCCC SMT solder joints

Abstract

Growth kinetics of interfacial Cu–Sn intermetallic (IMC) layer and its effect on the shear strength on practical LCCC surface mount solder joints were studied for isothermal aging at 70, 120, 155 and 170°C. Only normal Cu 6Sn 5 ( η-phase) intermetallic was found in the interfacial IMC layer of as-soldered solder joint, whereas the duplex structure of both η-phase and ε-phase Cu 3Sn existed in all annealed joints. The growth kinetics of the overall interfacial IMC layer can simply be described by classical kinetic theory for solid-state diffusional growth with an activation energy of 1.09 eV and interdiffusion coefficient of 1.61×10 −4 m 2 s −1. The relatively higher activation energy, as compared with that found for bi-metallic couple of eutectic Sn–Pb solder on copper, is attributed to the dissolution of Ni from the component metallization into the bulk Sn–Pb solder. In addition, the shear fractures in all the solder joints investigated are shown to be ductile in nature and confined in the bulk solder rather than through the interfacial IMC layer. A linear reduction in shear joint strength was observed with an increase in intermetallic layer thickness up to ∼5.6 μm. Such a reduction in joint strength is due to a continuous removal of Sn from the bulk solder for the growth of interfacial IMC layer and flattening of the solder/IMC layer during isothermal aging of the solder joint.