Abstract

ZnO thin films have been deposited on Si substrates by reactive ion beam sputtering deposition utilizing a capillaritron ion source. All the as-deposited ZnO films exhibit a preferred (0 0 2) growth direction while the grain size increases as oxygen partial flow rate increases. An optimum photoluminescence result was achieved using oxygen partial flow rate of ∼40% that the ratio of integrated deep level emission to that of integrated near-band-edge emission is less than 1.5. The atomic percentage ratio of Zn:O remains at 55/45, regardless of oxygen partial flow rates. With the applied substrate bias, the atomic percentage ratio of Zn/O changes to 40/60, indicating that stoichiometric ZnO may be achieved by selecting appropriate substrate bias. With the substrate bias applied, increased amount of oxygen atoms were found located in oxygen deficient matrixes, likely due to the bombardment of secondary ions.

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