Abstract
The morphology and composition of intermetallic compounds (IMCs) formed between substrate and solder play a vital role in the service life and failure of the solder joint, which is the most important part in the research of electronic packaging. Therefore, it is very important to investigate the growth and evolution of IMCs layer in the aging process. In this paper, there are particular phenomena in the interfacial reaction between the Sn-0.7Cu-10Bi-0.15Co solder and Cu substrate. The 0.15 wt% Co added to the matrix solder causes the abnormal transformation in the thickness and morphology of the IMCs. Because the CoSn3 phase is rapidly growing in a porous structure, so the intermetallic compounds are planar in morphology with an increasing thickness. In addition, the thickness of IMCs layer decreases because the CoSn3 with porous structure promotes the dissolution of the IMCs during aging for 200 h at 70 °C. Analytical results indicate that the Co element changes the diffusion channel and mechanism of the IMCs growth at the interface, and affects the growth kinetics of the CoSn3 phase in products; it in turn impacts the morphology and thickness of IMCs and reliability of solder joint.
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