Abstract
Abstract This study reports the current status of grain refinement of copper accompanied in particular by a critical appraisal of grain refinement of phosphorus-deoxidized, high residual P (DHP) copper microalloyed with 150 ppm Ag. Some deviations exist in terms of the growth restriction factor (Q) framework, on the basis of empirical evidence reported in the literature for grain size measurements of copper with individual additions of 0.05, 0.1, and 0.5 wt pct of Mo, In, Sn, Bi, Sb, Pb, and Se, cast under a protective atmosphere of pure Ar and water quenching. The columnar-to-equiaxed transition (CET) has been observed in copper, with an individual addition of 0.4B and with combined additions of 0.4Zr-0.04P and 0.4Zr-0.04P-0.015Ag and, in a previous study, with combined additions of 0.1Ag-0.069P (in wt pct). CETs in these B- and Zr-treated casts have been ascribed to changes in the morphology and chemistry of particles, concurrently in association with free solute type and availability. No further grain-refining action was observed due to microalloying additions of B, Mg, Ca, Zr, Ti, Mn, In, Fe, and Zn (~0.1 wt pct) with respect to DHP-Cu microalloyed with Ag, and therefore are no longer relevant for the casting conditions studied. The critical microalloying element for grain size control in deoxidized copper and in particular DHP-Cu is Ag.
Highlights
IN early work, grain refinements of copper[1,2] and low alloy copper were investigated in air
In the 1990s, grain refinement of copper was investigated under a protective atmosphere of pure Ar (99.997 pct),.[3,4,5,6]
In the aforementioned study[3] on the effect of solute elements on grain refinement of copper under a protective atmosphere of pure Ar, grain size measurements were reported for a constant solute addition of 0.1 pct, at a casting temperature of 1433 K (1160 °C), followed by water quenching
Summary
IN early work, grain refinements of copper[1,2] and low alloy copper (which here refers to a maximum of 2 pct[1] and 2.6 pct,[2]) were investigated in air. More detail is given later, but a focal point has been to identify inoculant particles and solutes, which could be generated from commercially available copper-based master alloys, for grain structure control of copper and in particular DHP-Cu during solidification. The effects of individual additions of B, Mg, P, Ca, Zr, and Ti (generally 0.4 and 0.8 pct) on grain structure of copper have been investigated under TP-1 casting conditions.[12] Second, the corresponding combined effects of double solute additions (Cu-0.4X-P) for B, Mg, Ca, Zr, Ti, Ag, and Fe with P additions (low (0.03-0.04 pct) and/or high 0.15 pct) have been assessed. The effects of additions of B, Mg, Ca, Zr, Ti, Sn, Ge, Mn, In, Ni, Fe, Zn, and Al (~0.1 wt pct) have been addressed with respect to DHP-Cu microalloyed with Ag
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