Abstract
Grain growth in vapor-deposited 81 at.% Ni+19 at.% Fe thin films 200 and 400 Å thick in the temperature range 350°–450°C has been investigated by transmission electron microscopy. The results have been interpreted in terms of a previously published model of grain growth in thin films on substrates. The activation energy for grain growth in this alloy has been determined as 1.7±0.2 eV.
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