Abstract
The results of investigations of nanostructured copper with a mean grain size of 75 nm processed by a new method of severe plastic deformation via consolidation of ball-milled powders are given in the paper. The investigations show that the processed copper has a rather stable nanostructure during annealing and elevated strength properties. A significant influence of deformation temperature on a growth of grain size and a decrease in values of internal stresses was also revealed. Evidently, this is connected with realization of recovery processes on grain boundaries and beginning of recrystallization processes already at low homological temperatures. The obtained results show that a state of grain boundaries in nanostructured copper is a very important parameter determining properties of nanostructured materials. To explain the experimental data, the structural model of R.Z. Valiev was taken as a basis. According to this model a structure of nanostructured material consists of ultra fine elastically aligned grains characterized by high density of grain boundary dislocations and disclinations. With all that, during annealing a recovery of these defects occurs.
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