Abstract
Electrodeposition of Au in mesoporous Si prepared in a highly doped p-type Si was investigated. When the Au electrodeposition was carried out using the complex Au(S2O3)23-, the mesopores with 5 µm depth were filled with Au continuously from the bottom to the opening. When the Au electrodeposition was carried out using the complex AuCl4-, the openings of the mesopores were covered with an Au film. The solution composition has a strong influence on the electrodeposition behavior. The effect of the displacement deposition occurring at the initial few seconds before conducting the Au electrodeposition seems to be a key factor for the difference. The different behaviors of the electrodeposition with different supporting electrolytes were compared and discussed.
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