Abstract
The electrodeposition of gold is a key technology in the fabrication of many microelectronic, optoelectronic and microsystem devices. In this review, we examine some recent applications, and consider the suitability of various gold plating systems for device fabrication. The properties of gold cyanide and sulfite baths and their limitations are considered first. This is followed by an analysis of the latest generation of non-cyanide baths, including the thiosulfate, sulfite-thiosulfate and ammonium gold systems. Plating baths containing mercaptoalkylsulfonic acid and hydantoin ligands are also briefly discussed. Finally an analysis of the stability of gold plating baths is presented.
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