Abstract
Purpose – The aim of the paper is to control the height and shape of solder interconnects employed in electronic packaging applications by an induction heating reflow method, which can achieve the solder bumping and interconnecting process in a simple way.Design/methodology/approach – Through the application of a designed induction heating system, a new methodology was forced to exhibit its certain qualities of forming and geometry controlling in the process. The corresponding temperature distribution has been analyzed based on a discussion of skin effects in metal spheres. The local melt phenomenon is observed and identified via the microstructures taken by scanning electron microscope (SEM).Findings – In this work, barrel‐shaped solder joints with high heights and hourglass‐shaped solder joints can be obtained, which is good for improving the solder joint lifetime. The mechanism of solder joint height and shape control, which can be explained by the local melt phenomenon, is discussed and demonstrated v...
Published Version
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