Generation of Self-Assembled 3D Network in TPU by Insertion of Al2O3/h-BN Hybrid for Thermal Conductivity Enhancement.

Kai-Han Su,Prem Chandan,Maw-Kuen Wu,Cheng-Ta Cho,Wan-Yu Chi,Po-Wei Chi,Cherng-Yuh Su

doi:10.3390/ma14020238

Abstract

Thermal management has become one of the crucial factors in designing electronic equipment and therefore creating composites with high thermal conductivity is necessary. In this work, a new insight on hybrid filler strategy is proposed to enhance the thermal conductivity in Thermoplastic polyurethanes (TPU). Firstly, spherical aluminium oxide/hexagonal boron nitride (ABN) functional hybrid fillers are synthesized by the spray drying process. Then, ABN/TPU thermally conductive composite material is produced by melt mixing and hot pressing. Then, ABN/TPU thermally conductive composite material is produced by melt mixing and hot pressing. Our results demonstrate that the incorporation of spherical hybrid ABN filler assists in the formation of a three-dimensional continuous heat conduction structure that enhances the thermal conductivity of the neat thermoplastic TPU matrix. Hence, we present a valuable method for preparing the thermal interface materials (TIMs) with high thermal conductivity, and this method can also be applied to large-scale manufacturing.

Highlights

The results indicate that the thermal conductivity of aluminium oxide/hexagonal boron nitride (ABN)/thermoplastic polyurethanes (TPU) composites is substantially improved from the synergistic association of Al2 O3 nanoparticles filled with h-boron nitride (BN)
The ABN functional hybrid filler was dispersed in the TPU matrix to form the therThe ABN functional hybrid filler was dispersed in the TPU matrix to form the thermally conductive composite
The FTIR was utilized in understanding the formation of the composite (30 wt.% of filler loading) with the preliminary identification of their chemical composite (30 wt.% of filler loading) with the preliminary identification of their chemical composition

Summary

Introduction

In this modern technological era, electronic gadgets and devices play a major role in every field. Apart from the above criteria, thermal management plays a critical part in designing electronic products. Thermal interface materials (TIM) play a vital role in enhancing heat transfer between heat sources and heat sinks [2]. Among the available polymeric matrixes for TIMs, thermoplastic polyurethanes (TPU) are attractive due to their highly versatile and unique properties. TPU is a kind of multiphase block copolymers, the thermomechanical properties can be tailored by changing the molecular chain structure of the soft and hard segments, and the recyclability of thermoplastics gives it an added advantage [3,4]

Methods

Results

Conclusion