Abstract

A micro- to milli-sized linear traveling wave (TW) actuator fabricated with microelectromechanical systems (MEMS) technology is demonstrated. The device is a silicon cantilever actuated by piezoelectric aluminum nitride. Specifically designed top electrodes allow the generation of TWs at different frequencies, in air and liquid, by combining two neighboring resonant modes. This approach was supported by analytical calculations, and different TWs were measured on the same plate by laser Doppler vibrometry. Numerical simulations were also carried out and compared with the measurements in air, validating the wave features. A standing wave ratio as low as 1.45 was achieved in air, with a phase velocity of 652 m/s and a peak horizontal velocity on the device surface of 124 μm/s for a driving signal of 1 V at 921.9 kHz. The results show the potential of this kind of actuator for locomotion applications in contact with surfaces or under immersion in liquid.

Highlights

  • Microelectromechanical systems (MEMS) are key components for the progress of miniaturization in disciplines such as consumer electronics, instrumentation, and healthcare [1]

  • Circular motors based on traveling wave (TW) are already well established, with the actuation of two degenerate modes and a proper spatial shift [7]

  • Linear motors have been accomplished by combining two modes at the same frequency, with either two bending modes [8] or a bending mode and a longitudinal mode [9,10]. Most of these approaches are millimeter-sized; their assembly is not commonly based on silicon monolithic technology, which would allow for cost reduction, manufacturing precision, and the possibility of system-level integration [11]

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Summary

Introduction

Microelectromechanical systems (MEMS) are key components for the progress of miniaturization in disciplines such as consumer electronics, instrumentation, and healthcare [1]. Robotic research on the micro and millimeter scales (i.e., the insect scale) has benefited greatly from technological advances in MEMS and other enabling technologies, such as additive manufacturing, piezoelectric actuators, and low power sensors [2,3]. In this field, the principles of locomotion are diverse [4,5]. Most of these approaches are millimeter-sized; their assembly is not commonly based on silicon monolithic technology, which would allow for cost reduction, manufacturing precision, and the possibility of system-level integration [11]

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