Abstract
In this paper, an analysis of gate–source and gate–drain scaling effects in MESFETs fabricated on hydrogen-terminated single-crystal diamond films is reported. The experimental results show that a decrease in gate–source spacing can improve the device performance by increasing the device output current density and its transconductance. On the contrary, the gate–drain distance produces less pronounced effects on device performance. Breakdown voltage, knee voltage, and threshold voltage variations due to changes in gate–source and drain–source distances have also been investigated. The obtained results can be used as a design guideline for the layout optimization of H-terminated diamond-based MESFETs.
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