Abstract
The gate bias stress-induced threshold voltage shift effect of amorphous indium gallium zinc oxide thin-film transistors (a-IGZO TFTs) with Cu gate is investigated in this brief. It is revealed that the Cu-gated TFTs with SiOx gate insulator suffer from serious electrical performance degradation under gate bias stress owing to Cu diffusion into the gate insulator and channel region. A stacked gate insulator of SiOx/SiNx is then proposed to suppress the Cu diffusion. Experimental results show that the Cu-gated TFTs with the stacked gate insulators have a comparable threshold voltage shift effect with that of the conventional TFTs with Mo electrode and SiOx insulator, under both positive and negative gate bias stresses.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.