Abstract

The influence of energy band structure on the electrical characteristics of GaN-based double-heterojunction bipolar transistors (DHBTs) has been studied through both simulation and fabrication. According to the simulation result, a novel DHBT structure with a composition graded base was grown and fabricated. A long minority carrier lifetime of 4.08 ns has been achieved for the composition graded p-InGaN base with a greatly improved material quality. The indium composition grading of the p-InGaN base layer combined with Si doping profile tuning for the collector layer was proposed to eliminate the energy barrier usually formed at the conventional GaN/InGaN/GaN base–collector (B–C) junction interface due to the band discontinuity and polarization effect. As a result, the as-fabricated DHBT presents a high intercept voltage of 225 V extracted from the <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$\textit{I}_{\textit{C}}$</tex-math> </inline-formula> – <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$\textit{V}_{\text{CE}}$</tex-math> </inline-formula> curves and a high current gain of 49.

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