Abstract
In a semiconductor devise fabrication process, cleaning process has shifted to single-wafer spin cleaning from bath method. For the single-wafer cleaning, effective liquid infiltration into micro scale pores is important. In this study, we theoretically and experimentally investigate the liquid infiltration process into closed end tubes. From the estimation of force balance, we found that the surface tension force is not enough for the infiltration of order of 100 ?m tubes and it is necessary external pressure to fill the tube. In addition we experimentally observed the relationship between external applied pressure and air volume in the tubes. As a result, it is found that the air compressibility is the dominant factor for the liquid infiltration and dissolution has a low impact.
Published Version
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