Abstract
In this paper, the authors presents about an Aerosol Jet printed interconnect technology between a GaAs MMIC and an LTCC packaging. Conductive silver nanoparticle and a dielectric polymer-based glob-top are utilized to fabricate die attach, dielectric ramp, and GCPW (Grounded Coplanar Waveguide) transmission line interconnect structures in order to interface a GaAs MMIC with an LTCC (Low Temperature Co-fired Ceramic) packaging substrate. The GCPW lines were printed using the Optomec Aerosol Jet 300 printer with silver nanoparticle ink from Paru. The printed minimal resolution of the interconnection was $34 \mu \mathrm{m}$ with a gap of $23 \mu \mathrm{m}$. Simulation and measurement results of printed interconnects were evaluated in a frequency range between 1 and 225 GHz. The printed interconnects including the MMICs and GCPWs on LTCC have shown an insertion loss of ca. 2 dB at 140 GHz. The reflection coefficient stayed below −10 dB until 210 GHz.
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