Abstract
A printed passive radiofrequency identification (RFID) tag in the ultra-high frequency band for light and temperature monitoring is presented. The whole tag has been manufactured by printing techniques on a flexible substrate. Antenna and interconnects are realized with silver nanoparticles via inkjet printing. A sprayed photodetector performs the light monitoring, whereas temperature measurement comes from an in-built sensor in the silicon RFID chip. One of the advantages of this system is the digital read-out and transmission of the sensors information on the RFID tag that ensures reliability. Furthermore, the use of printing techniques allows large-scale manufacturing and the direct fabrication of the tag on the desired surface. This work proves for the first time the feasibility of the embedment of large-scale organic photodetectors onto inkjet printed RFID tags. Here, we solve the problem of integration of different manufacturing techniques to develop an optimal final sensor system.
Highlights
The increasing interest in the Internet of things (IoT) has opened a new paradigm in the interaction between objects and human beings
radiofrequency identification (RFID) tags with sensing capabilities can be attached to objects, allowing their identification at different locations and obtaining information about their quality or the environment where they are placed
We present a novel ultra-high frequency (UHF) RFID tag developed on a flexible substrate including a photodetector
Summary
The increasing interest in the Internet of things (IoT) has opened a new paradigm in the interaction between objects and human beings. One of the existing alternatives to connect objects is the radiofrequency identification (RFID) technology. RFID tags with sensing capabilities can be attached to objects, allowing their identification at different locations and obtaining information about their quality or the environment where they are placed. In the case of products, it is especially interesting to know its status through the supply chains, leading to improvements in the inventory management as well as reductions in working capital and logistics costs [2]. This situation has led to a new paradigm in packaging [3]
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