Year-end Sale % OFF 
Abstract
Thermal crosstalk in a highly integrated RRAM array due to the self-heating effect is one of the most critical issues affecting device reliability. In this paper, two types of “thermal-house” structures are proposed to optimize the thermal management of the RRAM array. An in-house developed parallel simulator is employed to study the performance of the proposed thermal house structures in terms of resistance ratio and crosstalk temperature. It is demonstrated that the proposed thermal house structures can help to reduce thermal crosstalk in high-density RRAM arrays. Some suggestions are also provided for further improving the thermal management capability of the thermal houses as well.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
