Abstract
The electronic failure from accidental dropping event of modern handheld electronic devices may result from various failure modes such as cracking of PCB, solder joint etc. In this work, the dynamic response characteristics of electronic packages when subjected to board level drop impacts are investigated. Initially, board level drop tests are conducted on a custom made PCB as per JEDEC standard using a drop test apparatus. A Finite Element model of the free fall drop phenomenon is developed and numerical simulation is carried out using ANSYS 16.0 software based on two simplified Finite Element (FE) methods (Input-G method and Support Excitation Scheme) reported in the literatures are compared with experimental results to identify the most suitable FE method in terms of accuracy of the results produced. Using the identified FE method, the dynamic responses of PCBs with three different support configurations commonly used are analyzed to identify the best possible support configuration that can with stand drop impact loads better.
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