Abstract
Galvanic corrosion of lead-tin solder in copper plumbing can be a major contributor to water lead contamination. Here, we report the electrochemical reversal of the copper-solder galvanic couple, in which the normally anodic solder becomes cathodic to copper via a reaction with free chlorine. This reversal occurred after a few months of exposure to continuously circulating water with relatively low pH and low alkalinity, causing dramatically decreased lead release and the formation of a Pb(IV) scale. Chloramine did not similarly inhibit solder corrosion over the 4-9 month test duration, resulting in up to 100 times more lead contamination of the water relative to free chlorine. These findings have major implications for corrosion control and public health and can help explain anomalously low levels of lead contamination in some waters with free chlorine that are normally considered corrosive to solder.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
