Abstract
AbstractThe behavior of fractal growth based on copper metal was examined by micro‐point electrode electrodeposition. On this basis, the process and morphological characteristic of Cu fractal growth can be controlled by changing the electrodeposition time, current and concentration of Cu2+. The growth of snowflake Cu dendrites is confined to the two‐dimensional plane of the paper base to monitor the fractal structural changes. The electrodeposition process of snowflake Cu dendrites is deeply regulated by exploring the changing trend of fractal dimension. To further understand the fractal growth mechanism of Cu, the electro‐driven centripetal migration and random migration of ions are introduced in the traditional diffusion‐limited aggregation model. The simulated fractal patterns successfully correspond with the experimental results. The results are helpful to explore the fractal growth characteristics and dynamic mechanism of the electrodeposited copper dendrites, which lay a foundation for controlling the growth of the electrodeposited metal dendrites.
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