Abstract
Evolution of surface morphology of Au conductor lines under high-density electric current is studied by scanning tunneling microscopy. The loss of conductivity of thin Au films is found to occur through formation of voids resulted from electromigration followed by the depletion of the material. It is shown that the density of electric current passing through thin conducting films greatly affects their lifetime. Fractal analysis is employed to estimate numerically changes of surface topography of Au films. The fractal dimension is shown to be an optimum prefracture criterion for thin metal films under applying electric current.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
