Abstract
It is a currently dominant method to use wire saws for cutting silicon material because of its production efficiency and energy efficiency. Diamond wire saws, or fixed abrasive wire saws, have attracted much attention to researchers and engineers due to many advantages, including high cutting efficiency and low environmental pollution. This paper develops a novel diamond wire saw using ultraviolet curing technology. High-strength piano wires and polyethylene wires are selected as wire cores, and photosensitive resin is used as the binder. The problem of wire saw strength is mathematically formulated, and the effective parameters are analyzed. The surface morphology is analyzed for the developed diamond wire saw. A series of cutting experiments with different saws of varying manufacturing parameters are carried out. The slicing performance of such diamond wire saws is evaluated and compared. The experimental results show that the developed saw using the photosensitive resin has a very good performance in slicing silicon ingots. By the comparison between the developed diamond wire saw and the electroplated diamond wire saw, the surface smoothness of the workpiece is better than that by the latter.
Highlights
IntroductionDiamond wire saws or fixed abrasive wire saws have been attracting much attention in the community due to their many advantages [1,2,3]
For cutting silicon material, diamond wire saws or fixed abrasive wire saws have been attracting much attention in the community due to their many advantages [1,2,3]
This paper proposes a technology for developing diamond wire saw with photosensitive resin, based on our previous research results [8, 9]
Summary
Diamond wire saws or fixed abrasive wire saws have been attracting much attention in the community due to their many advantages [1,2,3] Their kerf loss is small, which can improve the utilization of materials, and they are attractive for machining expensive, hard, and brittle materials. Several major technical developments in diamond wire saw machining have emerged. This paper proposes a technology for developing diamond wire saw with photosensitive resin, based on our previous research results [8, 9]. According to the characteristics of the photosensitive resin, we develop different bonding agents for a diamond wire saw. A series of cutting experiments with different wire saws are carried out. The problem of wire saw strength is mathematically formulated, and the effective parameters are analyzed. The surface morphology is analyzed for the developed diamond wire saw. The slicing performance of such diamond wire saws is evaluated and compared in this paper
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