Abstract
The tunneling barrier is crucial to the overall performance in magnetic tunnel junctions. We have suggested a new formation method for the tunnel barrier, which has utilized pseudo-atomic layer deposition with sputtering. As is well known, all metallic thin films oxidize more or less under atmospheric conditions. Using this phenomenon, an ultra-thin metallic layer was prepared and exposed to the oxygen ambient repeatedly to reach a desired thickness for the tunnel barrier. From transmission electron microscopy, the tunnel barrier has been confirmed to have a clear and smooth interface between magnetic layers and the tunnel barrier. From atomic force microscopy, it has also been confirmed to have a low surface roughness. The fabricated magnetic tunnel junction has been shown to exhibit tunnel resistivities from 60 to 92 kΩ μm2 and a maximum tunneling magnetoresistance ratio of 40%.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
