Abstract
We investigated the corrosion behavior of the Sn–2.3wt.%Ag flip-chip solder bump in distilled water. At the early stage, dendritic corrosion products were converted into pyramidal shapes. The six pyramids grew simultaneously during a prolonged corrosion process. Finally, the octahedral corrosion products are formed. The octahedral corrosion product consisted of Sn and O, and was a mixture of amorphous and nanocrystalline SnO2 phase. The mechanism of this corrosion product was essentially a galvanic cell reaction.
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