Formation of microvias in epoxy-glass composites by laser ablation

Abstract

Single CO 2 laser pulses, of 10.6μm wavelength, are used to form blind microvias (holes in electronic boards for through-plating conducting paths) in copper-clad epoxy-glass laminates. The microvia dimensions depend on pulse energy and duration, the thicknesses of the epoxy-glass laminate and copper cladding, and the distribution of glass within the epoxy-glass laminate. The useful range of laser parameters, especially pulse energy, is primarily determined by the ability to metallize subsequently the blind microvias. Several conclusions can be drawn from the data. The pulse enegy should be within ±20% of the optimum value in order to form vias with a cylindrical geometry. For 300 μm thick laminates, the thickness of the copper on the bottom should be 18 μm or more. A larger range of pulse energies could be used if the glass fibre density was more uniform and if subsequent copper metallization of the blind vias could be improved.