Year-end Sale % OFF 
Abstract
By employing stress compensation technology in conjunction with an ultrahigh vacuum ion implanter, we have obtained two orders of magnitude smaller reverse-bias current levels in n+p junctions annealed at 550 °C as compared to the previous data. When samples are made with an optimum stress compensation condition, the magnitude of reverse-bias currents in n+p junctions as well as the carrier deactivation during post-implantation anneal becomes smallest. In order to further reduce the reverse-bias current level, it is shown that the elimination of contamination involvement during the implantation process is most essential.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
