Formation of intermetallic reaction layer and joining strength in nano-composite solder joint

Abstract

In this study, the effects of CeO2 nanoparticle addition on tensile strength and formation of interfacial intermetallic compound layer for lead-free Sn-3.5Ag-0.7Cu solder joint were investigated. The results showed that the thickness of intermetallic layer was decreased with increasing weight percentages of CeO2 reinforcements, and the growth of the intermetallic layer was remarkably suppressed during isothermal aging at 150 °C. It was also found that the tensile strength of the solder joint gradually increased with the addition of CeO2 particles, reached to the maximum value at 0.5 wt% CeO2 and then decreased drastically with further increase in CeO2 content. Microstructural investigation of 1 wt% CeO2 reinforced solder joint revealed that due to particle pushing under the influence of interfacial tension between the particles and the matrix, the brittle cluster-like regions with high concentration of CeO2 particles were formed inside the joint. These brittle clusters act as preferential site for crack initiation during tensile test which would degrade the tensile strength. Hence, based on the results obtained in this study, addition of CeO2 particles up to 0.5 wt% provide an optimized solder joint with improved strength together with suppressed intermetallic growth and long-term reliability.