Abstract
We confirmed that increasing the total metal concentration is effective for the planarization of Ni–W films and Ni–W nanopatterns formed with a uniform height and a 480 nm pitch. At the same time, the W content in Ni–W films decreased. We investigated the relationship between the planarization of Ni–W films and the W content in Ni–W films, and confirmed that increasing the total metal concentration is effective for the inhibition of hydrogen generation. We pointed to the inhibition of hydrogen gas generation as a cause of the planarization of Ni–W films, and the reduction in the hydrogen generation amount necessary for the deposition of W as a cause of the reduction in the W content in Ni–W films. In order to obtain a flat plating film with a high W content, it is necessary to generate an adequate amount of hydrogen on the surface of the cathode and to remove hydrogen gas from the cathode surface immediately.
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