Abstract

We have studied the influence of the ion species, ion energy, fluence, irradiation temperature and post-implantation annealing on the formation of shallow dislocation loops in silicon, for fabrication of silicon light emitting diodes. The substrates used were (100) Si, implanted with 20–80keV boron at room temperature and 75–175keV silicon at 100 and 200°C. The implanted fluences were from 5×1014 to 1×1015 ions/cm2. After irradiation the samples were processed for 15s to 20min at 950°C by rapid thermal annealing. Structural analysis of the samples was done by transmission electron microscopy and Rutherford backscattering spectrometry. In all irradiations the silicon substrates were not amorphized, and that resulted in the formation of extrinsic perfect and faulted dislocation loops with Burgers vectors a/2〈110〉 and a/3〈111〉, respectively, sitting in {111} habit planes. It was demonstrated that by varying the ion implantation parameters and post-irradiation annealing, it is possible to form various shapes, concentration and distribution of dislocation loops in silicon.

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