Abstract
Foreword: Special Section on Multiphysics Aspects of Power Electronics Packaging—Power Die, Power Module, and Converter Level—Part 1
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https://doi.org/10.1109/tcpmt.2024.3393588
Publication Date: May 1, 2024 |
Foreword: Special Section on Multiphysics Aspects of Power Electronics Packaging—Power Die, Power Module, and Converter Level—Part 1
Join us for a 30 min session where you can share your feedback and ask us any queries you have